General Applications:
- Dual Magnetron or
Single Magnetron Sputtering
- PVD Bias
- Plasma CVD
- Plasma Nitriding
- Plasma Desmear
- Surface cleaning and activation
- Etching Bias
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Applications PVD:
- Single Magnetron Sputtering
- Dual Magnetron Sputtering
- Magnetron Sputtering:
in Metallic Mode
in Oxide Mode
for Large Area Coatings
for Rotatables
tailor made applications for Reaserch and Development
Magnetron Sputtering using multiple pulses (“Pulse Bursts”)
- Co-Sputtering of different Target Materials simultaneously
- Arc Evaporation using pulsed plasma
- Combined Arc Evaporation and Magnetron Sputtering Applications
- Combined Hollow Cathode and Magnetron Sputtering Applications
- Superimposition of HiPIMS and:
1. MF Magnetron Sputtering
2. DC Magnetron Sputtering
- Synchronized HiPIMS or MF and pulsed Bias
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Materials:
- TiO2
- TiN
- TiCN
- Ti3SiC2
- SiNx
- CrN
- NiCr
- Ta2O5
- ITO
- SnO2
- WO3
- Carbon
- Al2O3
- ZrO2
- and many more…
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